一、錫膏的儲(chǔ)存
I. Storing solder pastes

A.錫膏應(yīng)保存在5-10℃環(huán)境下，保質(zhì)期為六個(gè)月（從生產(chǎn)日算起）。
B.在使用前，預(yù)先將錫膏從冰箱中取出室溫下至少4小時(shí)，這是為了使錫膏恢復(fù)至工作溫度，也是為防止水份在錫膏表面冷凝。
A. The solder pastes should be kept under the temperature of 5-10℃ at the shelf life of 6 months (calculated from the date of manufacture).
B. Before operation, first take the solder pastes out of refrigerators and let them stay at a room temperature for at least 4 hours to enable the solder pastes to recover to the operating temperature and also to prevent moisture from surface condensation on solder pastes.

二、 錫膏攪拌
II. Solder paste mixing

A.為了使錫膏完全地混合均勻，在回溫后請(qǐng)充分?jǐn)嚢桢a膏。
B．機(jī)器攪拌一般為1~3分鐘，人工攪拌一般為3~6分鐘（錫膏儲(chǔ)存的時(shí)間越長(zhǎng)，則攪拌時(shí)間越長(zhǎng)）。
A.In order for solder pastes to be completely mixed in a well distributed manner, after the return of temperature, please adequately mix the solder pastes.
B. The mechanical mixing usually last 1 to 3 minutes, while manual mixing usually lasts 3 to 6 minutes (The longer time the solder pastes are kept, the longer time the mixing requires).

三、使用環(huán)境
III. Operating Environment

錫膏最佳的使用環(huán)境：溫度為20~25℃，濕度為35~60%。
Optimal operating environment of solder pastes: temperature at 20~25℃, and humidity 35~60%。

四、印刷
IV. Printing

印刷時(shí)錫膏使用注意事項(xiàng)：
A、將錫膏約1/3的量添加于鋼網(wǎng)上，并以少量多次的添加方式補(bǔ)足鋼網(wǎng)上的錫膏量、以維持錫膏的品質(zhì)。
B、當(dāng)天未使用完的錫膏，不可與尚未使用的錫膏共同放置，應(yīng)另外存放在別的容器中。錫膏開(kāi)封后在室溫下建議于24小時(shí)內(nèi)用完。
C、當(dāng)天未用完的錫膏，隔天使用時(shí)建議將未用完的錫膏與新錫膏以1：2的比例攪拌混合使用，并以少量多次的方式添加使用。
D、錫膏印刷在基板上后，建議于4～6小時(shí)內(nèi)放置元件進(jìn)入回焊爐。
E、換線超過(guò)一小時(shí)以上，請(qǐng)于換線前將錫膏從鋼網(wǎng)上刮起收入錫膏罐內(nèi)封蓋。
F、盡可能不要接觸到皮膚，如接觸時(shí)請(qǐng)用異丙醇清洗，并且避免吸入揮發(fā)之氣體。
Cautions in the operation of solder pastes during printing:
A、 Add 1/3 solder pastes on a steel screen by supplementing enough solder pastes in a manner of a small amount in several times to maintain the quality of solder pastes.
B、 For the solder pastes that have not run out, do not place them together with those unused solder pastes. They should be put in other containers. After being unsealed, the solder pastes should be completely used under a room temperature within 24 hours.
C、 For the solder pastes that have not run out the same day, it is recommended that the unused solder pastes on the other day will be mixed with new solder pastes in the ratio of 1:2 for mixing and using, and they will be used in a manner of adding in a small amount in several times.
D、 After solder pastes are printed on substrates, it is recommended that components should be placed into the return solder pots within 4 to 6 hours.
E、 When wire exchange exceeds one hour or more, please scrape the solder pastes up from the steel screen and put it into the solder paste container for sealing.
F、 Try not to make it contact skin. In the case of any such contact, please use isopropanol for rinsing, and try to avoid inhalation of the volatile gases.s